FAQ

QA component solidified.

A Freezing may occur depending on the type of resin.Use by heating and dissolving at 40°C to 50°C.Shake thoroughly after dissolving to make even.Do not heat too much.

QB component solidified or became turbid.

A The following points can be thought.
【1】Freeze may occur depending on the variety of Hei-Cast when the liquid temperature is below 15°C.Dissolve the freezing B component in a short time by heating the solution to 60°C to 80°C.Do not continue heating more than necessary after complete dissolution.
【2】There is a possibility that water and isocyanate may have generated a chemical reaction and then hardened due to moisture in the air or moisture in B component.In that case, unlike the above-mentioned freeze, it will not dissolve even if it is heated, so dispose of it.
Regarding disposal, please click here.

QIs it flammable?

A It is flammable.The flash point varies depending on the product. Refer to the Safety Data Sheet (SDS) for details.

QDoes the resin turn yellow?

A Some of them become yellowish, but there are also materials hard to become yellowish.

QThe resin does not cure completely.

A The following points can be thought.
【1】Mixing and stirring of A component and B component may be insufficient, and the mixture may not be mixed well.
【2】Put B component into the measuring container, then add the necessary amount of A component and mix and stir to improve stickiness due to seepage of unmixed liquid.Reconsider the stirring time, liquid temperature, stirring blade and container.
Mixing and stirring of A component and B component may be insufficient, and the mixture may not be mixed well.Reconsider the stirring time, liquid temperature, stirring blade and container.
【3】There is a possibility that the mixing ratio is deviated.Weighing within ±5% is recommended.If the mixing ratio deviates extremely, stickiness will occur or it may not harden.

QSink mark is produced at the corner of the molded product.

A mold temperature is too low.The same tendency can be seen when the liquid temperature is too low.

QA striped pattern is generated.

A Mixing and stirring are insufficient.Stir the two components thoroughly.This phenomenon is more likely to occur when using a static mixer with fewer elements.Increase the number of elements.

QThe curing time of the resin is fast.

A The liquid temperature may be too high.If heated, return to room temperature before use.In rare cases, curing time may be accelerated with added colorants.

QThe curing time of the resin is slow.

A This is a phenomenon that tends to occur when the liquid temperature, mold temperature, and the temperature of the applied parts are low. Warm liquids, molds, or materials to be applied.

QDoes it have heat resistance ?

A It is generally said that the operating temperature is up to 80°C, depending on the product.
When the temperature exceeds 120°C, decomposition begins.Heat resistant grades are also available.

QThe molded product cannot be demolded from the silicone mold.

A We propose the following measures.
【1】Demold by putting a small amount of ethanol or isopropyl alcohol between the mold and the product.
【2】Demold by putting compressor air between the mold and the product.
【3】For deep molds, it is recommended to provide an air inlet when making the silicone mold. Also, when casting with a mold that has not been used for a long time, or when casting urethane resin with a mold that uses epoxy resin, the mold and resin may adhere.

QA component and B component become no longer unnecessary.How should it be disposed ?

A Mix A component and B component as little as possible to cure them and dispose of them as plastics.Dispose of the can as metals.
When disposing of a large amount, dispose of it according to the regulations of the national and local governments.

QIs it possible to adjust the pot life by changing the mixing ratio ?

A It is not possible to adjust the pot life by changing the mixing ratio.
If you increase or decrease the compounding ratio so that the pot life changes, it will not cure.
Bleeding or blistering may occur even if it hardens.

QA lot of bubbles are involved in the resin.

A This is the effect of moisture caused by moisture absorption.
Carbon dioxide gas is generated by the reaction of isocyanate (B component) with water.
This occurs when A component is left open or when there is much space in the container.

QThe expansion ratio of the foam type resin has increased.

A When it absorbs moisture, it foams more than planned.
Please manage so as not to absorb moisture.

QThe physical properties of the molded product are poor.

A This phenomenon is likely to occur when the mold temperature is low.
Check that the mold temperature is at the recommended temperature.
The temperature distribution in the thermostatic chamber varies.
Make sure that the mold temperature is at the required level when casting.

QDoes it have flame resistance ?

A Hei-Cast 3263 has obtained UL94 V-0 certification

QThe surface of the resin does not harden when the resin is poured into the silicone mold.

A This phenomenon is likely to occur when addition type silicone rubber is used.
The curing may be inhibited due to the material of the master model and the effects of paint and putty.
It is recommended to check in advance.It may harden if heated in a thermostatic chamber for a long time, but it seems that there are many cases which the mold is re-made in.
If you want to avoid curing inhibition, use a condensation type silicone rubber rather than an addition type.